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Intel XEON Solucion Termica COMBO BXSTS100C Cod. Producto: A-2660   ||  Fabricante: INTEL Part Number:    Stock: 0 Unidades Entrega en el Día ver condiciones Envio: Gratis Descatalogado
Producto
Intel XEON Solucion Termica COMBO BXSTS100C
Descripción
Disipador para procesador - ( Socket 1366 ) Maximum CPU TDP: 130W With fan installed: - Pedestal chassis that provides adequate ventilation and correct temperature air to heat sink With fan removed: - Pedestal chassis with ducted airflow to heat sink - 2U or larger rack chassis with ducted airflow to heat sink
Especificaciones
Product Type: Cooling Fan/HeatsinkCompatibility: - Intel Xeon processors - Intel LGA1366 socketApplication/Usage: ProcessorAdditional Information: Maximum CPU TDP: 130WWith fan Installed: - Pedestal chassis that provides adequate ventilation and correct temperature air to heat sinkWith fan removed: - Pedestal chassis with ducted airflow to heat sink - 2U or larger rack chassis with ducted airflow to heat sink
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Quick Hard, S.L. 2000-2022 Av. Monforte de Lemos, 103 Lateral ( Barrio del Pilar ) 28029 Madrid Tfno 91 294 51 05 Horario : Lunes a Viernes 10:30 a 14:00 y de 17:00 a 20:00
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